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PR308S31ESU features i t (rms) 8a, built-in snubber circuit reinforced insulation type non-zero cross type sip 4pin triac output ssr 1. output current, i t (rms) 8.0a 2. non-zero crossing functionary 3. 4 pin sip package 4. high repetitive peak off-state voltage (v drm : 600v) 5. built-in snubber circuit 6. reinforced insulation type (min. 0.4mm internal sep- aration) 7. high isolation voltage between input and output (v iso (rms) : 3.0kv) 8. screw hole for heat sink description PR308S31ESU reinforced insulation type solid state relays (ssr) are an integration of an infrared emitting diode (ired), a phototriac detector and a main output triac. these devices are ideally suited for controlling high voltage ac loads with solid state reli- ability while providing 3.0kv isolation (v iso (rms) ) from in- put to output. 1 notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. PR308S31ESU agency approvals/compliance 1. isolated interface between high voltage ac devices and lower voltage dc control circuitry. 2. switching motors, fans, heaters, solenoids, and valves. 3. phase or power control in applications such as light- ing and temperature control equipment. applications 1. recognized by ul508, file no. e94758 (as models no. pr308s31 ) 2. approved by csa 22.2 no.14, file no. lr63705 (as models no. pr308s31 ) 3. approved by t?v en60950 (reinforced insulation), file no. r9051479 (as models no. pr308s31 ) 4. package resin : ul flammability grade (94v-0) sheet no.: d4-a03601en date apr. 28. 2004 ?sharp corporation ? zero cross type is also available. ( pr308s41esu )
( ) : typical dimensions internal connection diagram 1 1 2 3 4 2 3 4 output (triac t2) output (triac t1) input ( + ) input ( ? ) 2 outline dimensions (unit : mm) 12 4 3 5.5 0.2 0.6 0.1 18.5 0.2 4-1.1 0.2 4-1.25 0.3 4-0.8 0.2 16.4 0.3 (5.08) (7.62) (2.54) (1.4) 5.0 0.3 19.6 0.2 (36.0) 3.2 0.2 2 max. 4.2 max. 11.2 min. common to pin no.1 common to pin no.1 3.2 0.2 + 8a260vac ? model no. ul mark csa mark t?v mark date code (2 digit) epoxy resin pr308s31 PR308S31ESU sheet no.: d4-a03601en product mass : approx. 6.5g
date code (2 digit) rank mark there is no rank mark indicator and currently there are no rank offered for this device. a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production country of origin japan 3 repeats in a 20 year cycle PR308S31ESU sheet no.: d4-a03601en
electro-optical characteristics parameter symbol unit input output (t a = 25?c) forward voltage reverse current on-state voltage minimum operating current open circuit leak current critical rate of rise of off-state voltage critical rate of rise of off-state voltage at commutaion minimum trigger current isolation resistance turn-on time turn-off time thermal resistance v f i r v t (rms) i op (rms) i leak (rms) dv/dt (dv/dt)c i ft r iso t on t off r th (j-c) r th (j-a) v a v ma ma v/ s v/ s ma ? ms ms ?c /w i f = 20ma v r = 3v i t (rms) = 2a, resistance load, i f = 20ma v out (rms) = 240v v out (rms) = 240v v d = 2/3? drm t j = 125 ?c , v d = 2/3? drm , di t /dt = ? 4.0a/ms v d = 12v, r l = 30 ? dc500v, 40 to 60%rh v d (rms) = 200v, ac50hz i t (rms) = 2a, resistance load, i f = 20ma between junction and case between junction and ambient conditions min. typ. max. transfer charac- teristics ? ? ? ? ? 30 5 ? 10 10 ? ? ? ? 1.2 ? ? ? ? ? ? ? ? ? ? 4.5 40 1.4 100 1.5 50 10 ? ? 10 ? 1 10 ? ? absolute maximum ratings 4 parameter symbol rating unit input output (t a = 25?c) forward current reverse voltage rms on-state current peak one cycle surge current repetitive peak off-state voltage non-repetitive peak off-state voltage critical rate of rise of on-state current operating frequency isolation voltage operating temperature storage temperature soldering temperature *2 *1 i f v r i t (rms) i surge v drm v dsm di t /dt f v iso (rms) t opr t stg t sol ma v a a v v a/ s hz kv ?c ?c ?c *3 *3 *4 50 6 8 80 600 600 50 45 to 65 3.0 ? 20 to + 80 ? 30 to + 100 260 *1 40 to 60%rh, ac for 1minute, f = 60hz *2 for 10s *3 refer to fig.1, fig.2 *4 f = 50hz sine wave, t j = 25?c start PR308S31ESU soldering area 1.5mm sheet no.: d4-a03601en
5 please contact a local sharp sales representative to see the actual status of the production. PR308S31ESU sheet no.: d4-a03601en model line-up (lead solder plating components) shipping package en60950 (reinforced insulation) model no. case 200pcs/case approved i ft [ma] (v d = 12v, r l = 30 ? ) PR308S31ESU ? ? max.10 600 v drm [v]
6 PR308S31ESU fig.2 rms on-state current vs. ambient temperature fig.1 forward current vs. ambient temperature sheet no.: d4-a03601en rms on-state current i t (rms)(a) ambient temperature t a (?c) 0 10 9 8 7 6 5 4 3 2 1 ? 20 100 75 80 50 25 125 0 (1) (2) (3) (4) (5) (6) (1) with infinite heat sink (2) with heat sink (200 200 2mm al plate) (3) with heat sink (100 100 2mm al plate) (4) with heat sink (75 75 2mm al plate) (5) with heat sink (50 50 2mm al plate) (6) without heat sink (note) in natural cooling condition, please locate al plate vertically, spread the thermal conductive silicone grease on the touch surface of the device and tighten up the device in the center of al plate at the torque of 0.4n?. 1 10 0.9 1.1 1 1.2 1.3 1.4 1.5 100 forward current i f (ma) forward voltage v f (v) t a =75?c 50?c 25?c 0?c fig.4 forward current vs. forward voltage fig.3 rms on-state current vs. case temperature 0 2 4 6 8 ? 20 0 20 40 60 80 100 120 140 rms on-state current i r (rms)(ma) case temperature t c (?c) 0 10 20 30 40 50 60 ? 20 0 25 50 75 80 100 125 forward current i f (ma) ambient temperature t a (?c)
7 PR308S31ESU sheet no.: d4-a03601en remarks : please be aware that all data in the graph are just for reference. fig.7 maximum on-state power dissipation vs. rms on-state current maximum on-state power dissipation (w) rms on-state current i t (rms)(a) 0 10 12 12 810 6 4 2 0 8 6 4 2 t a = 25?c fig.5 surge current vs. power-on cycle surge current i surge (a) power-on cycle (times) 0 110 100 f = 50hz sine wave t j = 25?c start 100 80 60 40 20 fig.6 minimum trigger current vs. ambient temperature minimum trigger current i ft (ma) ambient temperature t a (?c) 0 10 ? 20 0 20 4 06080 8 6 4 2 v d = 12v fig.8 open circuit leak current vs. supply voltage open circuit leak current i leak (rms)(ma) supply voltage v out (rms)(v) 0 6 080 160 240 320 5 3 2 4 1 t a = 25?c
8 PR308S31ESU design considerations in order for the ssr to turn off, the triggering current (l f ) must be 0.1ma or less. in phase control applications or where the ssr is being by a pulse signal, please ensure that the pulse width is a minimum of 1ms. for over voltage protection, a varistor may be used. a varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. the load current should be within the bounds of derating curve. (refer to fig.2) also, please use the optional heat sink when necessary. in case the optional heat sink is used and the isolation voltage between the device and the optional heat sink is needed, please locate the insulation sheet between the device and the heat sink. when the optional heat sink is equipped, please set up the m3 screw-fastening torque at 0.3 to 0.5n?. in order to dissipate the heat generated from the inside of device effectively, please follow the below sugges- tions. (a) make sure there are no warps or bumps on the heat sink, insulation sheet and device surface. (b) make sure there are no metal dusts or burrs attached onto the heat sink, insulation sheet and device sur- face. (c) make sure silicone grease is evenly spread out on the heat sink, insulation sheet and device surface. silicone grease to be used is as follows; 1) there is no aged deterioration within the operating temperature ranges. 2) base oil of grease is hardly separated and is hardly permeated in the device. 3) even if base oil is separated and permeated in the device, it should not degrade the function of a device. recommended grease : g-746 (shin-etsu chemical co., ltd.) : g-747 (shin-etsu chemical co., ltd.) : sc102 (dow corning toray silicone co., ltd.) in case the optional heat sink is screwed up, please solder after screwed. design guide sheet no.: d4-a03601en recommended operating conditions parameter symbol unit input output input signal current at on state input signal current at off state load supply voltage load supply current frequency operating temperature i f (on) i f (off) v out (rms) i out (rms) f t opr ma ma v ma hz ?c ? ? ? ? ? ? conditions 30 0.1 240 i t (rms) 80%( ? ) 63 80 20 0 80 0.1 47 ? 20 min. max. ( ? ) see fig.2 about derating curve (i t (rms) vs. ambient temperature).
9 PR308S31ESU sheet no.: d4-a03601en degradation in general, the emission of the ired used in ssr will degrade over time. in the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. therefore in order to maintain proper operation, a design implementing these ssrs should provide at least twice the minimum required triggering current from initial operation. in case of the lead frame bending, please keep the following minimum distance and avoid any mechanical stress between the base of terminals and the molding resin. some of ac electromagnetic counters or solenoids have built-in rectifier such as the diode. in this case, please use the device carefully since the load current waveform becomes similar with rectangu- lar waveform and this results may not make a device turn off. example how to equip optional heat sink for reinforced isolation 1) case of isolation sheet whose thickness is 0.4mm or more (v iso : 3kv or more) 2) case of the use of double isolation sheet (v iso : each 3kv or more) please keep 5mm distance as minimum between naked metal portion of ssr and heat sink, and also be- tween naked metal portion of ssr and bis/nut/washer. however, please avoid the natural rubber for isolation sheet. 4.4mm min. heat sink ssr 0.4mm thickness or more isolation sheet heat sink ssr isolation sheet
10 PR308S31ESU ? for additional design assistance, please review our corresponding optoelectronic application notes. standard circuit tr1 r 1 d 1 v 1 + v cc ac line load ssr 3 4 1 2 PR308S31ESU sheet no.: d4-a03601en
manufacturing guidelines soldering method flow soldering (no solder bathing) flow soldering should be completed below 260?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please solder within one time. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 11 PR308S31ESU sheet no.: d4-a03601en
12 solvent cleaning : solvent temperature should be 45?c or below. immersion time should be 3minutes or less. ultrasonic cleaning : the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials : ethyl alcohol, methyl alcohol and isopropyl alcohol. in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this device. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. presence of odc PR308S31ESU sheet no.: d4-a03601en
package specification 13 molt plane partition pad packing case cushioning material product PR308S31ESU sheet no.: d4-a03601en package materials packing case : corrugated cardboard partition : corrugated cardboard pad : corrugated cardboard cushioning material : polyethylene molt plane : urethane package method the product should be located after the packing case is partitioned and protected inside by 4 pads. each partition should have 5 products with the lead upward. cushioning material and molt plane should be located after all products are settled (1 packing contains 200 pcs). package composition
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 14 important notices PR308S31ESU sheet no.: d4-a03601en

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